BM311B Hybrid AOI Machine is mainly applied to the appearance inspection of power semiconductor modules, IPMs, substrates and AMB products, and makes it possible to measure the dimensions of die, wire, bond, DBC, Pin and detect their defects
Module size
Max 400*400mm
False call rate
≤2%
Fast and accurate
Win customer recognition for outstanding detection performance and reliable automation integration
Strong compatibility
Support the defect detection of IGBTs, IPMs, substrates and AMB products
High efficiency
Up to 600UPH for 40∗40mm^2 substrate inspection
Excellent accuracy:
2D and 3D detection and measurement accuracy reaches ±5μm@3σ
Easy to use:
AI-based auto generation of inspection areas makes recipe creation a lot easier
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+86-0510-81816658
sales@wxautowell.com
No.3 Xinhua Road,
